sales@normantherm.com
+977-9841230987

Vacuum Brazing of Copper Water-Cooled Plate

Semiconductor

Vacuum Brazing of Copper Water-Cooled Plate Hero 1

Project Brief

Vacuum brazing of copper water-cooled plates is an advanced manufacturing process used to produce reliable cooling components with excellent thermal conductivity and leak-tight internal channels. Copper provides efficient heat transfer, while vacuum brazing creates strong joints without oxidation or surface contamination.

Process
The process begins with cleaning and precisely assembling copper plates and internal cooling channels, followed by applying a suitable brazing filler material. The assembly is heated inside a high-vacuum brazing furnace under controlled temperature conditions. The molten filler flows evenly through the joint areas, creating a strong and sealed connection. Controlled cooling helps maintain dimensional accuracy and minimize thermal stress.

Application Industries
Vacuum-brazed copper water-cooled plates are widely used in power electronics, semiconductor, automotive, aerospace, laser systems, electrical equipment, renewable energy, and industrial cooling industries. Typical applications include IGBT cooling plates, semiconductor cooling systems, laser cooling, battery thermal management, and high-power electronic equipment.

With excellent thermal conductivity, uniform cooling, leak-tight joints, and high reliability, vacuum-brazed copper water-cooled plates provide an efficient solution for demanding thermal management applications.

Ready to Achieve Similar Results?

Let's Solve Your Thermal Challenges

Speak to our Semiconductor specialist today and discover how our solutions can transform your processes.