sales@normantherm.com
+977-9841230987

Vacuum Brazed Copper Liquid Cooling Plate

Semiconductor

Vacuum Brazed Copper Liquid Cooling Plate Hero 1

Project Brief

Copper liquid cooling plates are widely used in applications where efficient and reliable heat dissipation is critical. In this customer case, a copper liquid cooling plate was successfully processed using vacuum brazing to create the internal cooling structure and achieve a clean, reliable joint.

Vacuum brazing provides a controlled, low-contamination environment that helps minimize oxidation during the brazing process. Precise temperature control and uniform heating are particularly important for copper components, ensuring proper filler-metal flow and consistent bonding across the cooling plate.

The finished product demonstrates the capability of Norman Vacuum Furnace technology for manufacturing high-quality liquid cooling components. Vacuum brazing can be applied to cooling plates used in power electronics, EV battery thermal management, semiconductor equipment, and other high-heat-flux applications where efficient heat transfer and reliable sealing are essential.

Application: Vacuum Brazing
Component: Copper Liquid Cooling Plate
Material: Copper
Process: Vacuum Brazing
Key Requirements: Uniform bonding, clean surface, reliable sealing and dimensional stability

Need a vacuum furnace for copper cooling plate brazing?
Contact Norman Vacuum Furnace to discuss your cooling plate design, material, brazing alloy and production requirements.

Ready to Achieve Similar Results?

Let's Solve Your Thermal Challenges

Speak to our Semiconductor specialist today and discover how our solutions can transform your processes.